Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Flat Response From DC to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (T;

MACOM

Attenuator DIE

文件：460.03 Kbytes 頁數(shù)：3 Pages

MA-COM

Package：模具；包裝：卷帶（TR） 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：RF ATTENUATOR 6DB DIE

MACOM Technology Solutions

SILICON CARBIDE SCHOTTKY POWER RECTIFIER

文件：175.76 Kbytes 頁數(shù)：4 Pages

MICROSEMI

美高森美

10A / 600V Silicon Carbide Dual Schottky Rectifier

文件：80.93 Kbytes 頁數(shù)：3 Pages

MICROSEMI

美高森美

10A / 600V Silicon Carbide Dual Schottky Rectifier

文件：80.93 Kbytes 頁數(shù)：3 Pages

MICROSEMI

美高森美