Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·DC to 40 GHz\n·Medium Power Handling 2W CW\n·Flat Response From DC to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Return Loss > 16 dB 13 to 40 GHz\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Ground Wrap to Top (No ground bond;

MACOM

Attenuator DIE

文件：460.03 Kbytes 頁數(shù)：3 Pages

MA-COM

Package：模具；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：RF ATTENUATOR 2DB DIE

MACOM Technology Solutions

Eighth Brick Power Module Heat Sinks

文件：572.99 Kbytes 頁數(shù)：9 Pages

LINEAGEPOWER

Eighth Brick Power Module Heat Sinks

文件：572.99 Kbytes 頁數(shù)：9 Pages

LINEAGEPOWER

Silicon Photomultipliers (SiPM), Low-Noise, Blue-Sensitive

文件：1.61235 Mbytes 頁數(shù)：16 Pages

ONSEMI

安森美半導體