Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 530 nm (● true green) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.80441 Mbytes 頁數(shù)：23 Pages

OSRAM

艾邁斯歐司朗

OSRAM OSRAM OSTAR? Projection Compact, KT CULPM1.13

結(jié)構(gòu)緊湊的光源設(shè)計，熱點分離的焊盤設(shè)計能夠提高散熱性能，高電流芯片技術(shù)可以提高光學(xué)輸出。

ams-OSRAM

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 530 nm (● true green) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.80441 Mbytes 頁數(shù)：23 Pages

OSRAM

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 530 nm (● true green) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.80441 Mbytes 頁數(shù)：23 Pages

OSRAM

艾邁斯歐司朗