HIGH DENSITY PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

DESCRIPTION The IS20*, ISD20*, ISQ20*series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages. FEATURES ? Options :- 10mm lead spread - add G after part no. Surface moun

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ISOCOM

英國(guó)安數(shù)光

HIGH DENSITY PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

[Isocom] DESCRIPTION The IS20*, ISD20*, ISQ20*series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages. FEATURES ? Options :- 10mm lead spread - add G after part no.

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ETCList of Unclassifed Manufacturers

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IS202 High Density Transistor Detector 6 Pin, Single

ISOCOM

英國(guó)安數(shù)光

Bluetooth? 4.1 Stereo Audio SOC

文件：2.76833 Mbytes 頁(yè)數(shù)：57 Pages

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Bluetooth? 4.1 Stereo Audio SOC

文件：2.76833 Mbytes 頁(yè)數(shù)：57 Pages

ETCList of Unclassifed Manufacturers

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Bluetooth? 4.1 Stereo Audio SOC

文件：2.76833 Mbytes 頁(yè)數(shù)：57 Pages

ETCList of Unclassifed Manufacturers

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Bluetooth? 4.1 Stereo Audio SOC

文件：2.76833 Mbytes 頁(yè)數(shù)：57 Pages

ETCList of Unclassifed Manufacturers

未分類(lèi)制造商

Bluetooth? 4.1 Stereo Audio SOC

文件：2.76833 Mbytes 頁(yè)數(shù)：57 Pages

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Bluetooth Silicon Products

The IS2021 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 with Enhanced Data Rate 2.4GHz applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.? It in ? Bluetooth 5 certified\n? HFP 1.6\n? HSP 1.1\n? A2DP 1.2\n? AVRCP 1.5\n? SPP 1.0\n? PBAP 1.0\n? 16MHz main clock input\n? Built-in internal ROM for program memory\n? Support to connect to two hosts ( phones, tablets…) with HFP or A2DP profiles simultaneously\n? Adaptive Frequency Hopping (AFH) avoi;

Microchip

微芯科技

Bluetooth Silicon Products

The IS2025 stereo audio chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications.? This chip is fully compliant with Bluetooth specifications and is completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.? It incorporates Bluetooth 1M/2M ? Bluetooth 5 certified\n? HFP 1.6\n? HSP 1.1\n? A2DP 1.2\n? AVRCP 1.5\n? SPP 1.0\n? PBAP 1.0\n? 16MHz main clock input\n? Built-in internal ROM for program memory\n? Support to connect to two hosts ( phones,tablets…) with HFP or A2DP profiles simultaneously\n? Adaptive Frequency Hopping (AFH) avoid;

Microchip

微芯科技