HSCMANN150PG3B3中文資料霍尼韋爾數(shù)據(jù)手冊(cè)PDF規(guī)格書

Features and Benefits

Industry-leading accuracy

Extremely tight accuracy of ±0.25 FSS BFSL (Full Scale Span Best Fit Straight

Line) reduces software needed to correct system inaccuracies, minimizing system

design time:

? Avoids additional customer calibration.

? Helps to improve system efficiency.

? Often simplifies software development.

High burst pressures

? Promotes system reliability and reduces potential system downtime.

? Can simplify the design process.

High working pressure ranges

Allows ultra-low pressure sensors to be used continuously well above the

calibrated pressure range.

Industry-leading flexibility

Modular, flexible design with many package styles (with the same industryleading

stability), pressure ports, and options simplify integration into the device

manufacturer’s application.

Wide variety of pressure ranges

From ±1.6 mbar to ±10 bar | ±160 Pa to ±1 MPa | ±0.5 inH2O to 150 psi provide

support for many unique applications.

Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level

1 requirementS

? Allows the customer to avoid the thermal and mechanical damage during

solder reflow attachment and/or repair that lesser rated products would incur.

? Allows unlimited floor life when stored as specified (<30 oC/85 RH),

simplifying storage and reducing scrap.

? Never requires lengthy bakes prior to reflow.

? Stable and usable shortly after reflow process allows for lean manufacturing.

OPTIONAL Internal diagnostic functions

? May reduce the need for redundant sensors in the system.

? Detects most internal failures including burst sensors.

Energy efficient

Extremely low power consumption (less than 10 mW, typ.):

? Reduces system power requirements.

? Enables extended battery life.

? Optional sleep mode available upon special request.

Output: ratiometric analog; I2C- or SPI-compa tible

14-bit digital output (min. 12-bit sensor resolution)

Accelerates performance through reduced conversion requirements and the

convenience of direct interface to microprocessors.

Small size

Miniature 10 mm x 10 mm [0.39 in x 0.39 in] package is very small when

compared to many board mount pressure sensors:

? Occupies less area on the PCB.

? Typically allows for easy placement on crowded PCBs or in small devices.

REACH and RoHS compliant

Liquid media option

? Provides robustness in environments with condensing humidity.

? Compatible with a variety of non-ionic fluids.

? Available for pressure ranges above 40 mbar | 4 kPa | 20 inH20.