Wi-Fi 4 & BLE 5.2 模塊小尺寸DIP + LCC 封裝工作溫度：-40 °C ~ +105 °C

FLM240D是移遠(yuǎn)通信推出的高性?xún)r(jià)比MCU Wi-Fi和藍(lán)牙Combo模塊，處理器主頻高達(dá)120 MHz，支持 IEEE 802.11b/g/n協(xié)議和BLE 5.2，內(nèi)置256 KB RAM、2 MB或4 MB Flash，符合WPA-PSK、WPA2-PSK及WPA3-SAE安全協(xié)議標(biāo)準(zhǔn)。\n\n FLM240D為DIP + LCC封裝，超緊湊的尺寸為17.3 mm × 15.0 mm × 2.8 mm，能最大限度地滿(mǎn)足終端產(chǎn)品對(duì)小尺寸模塊產(chǎn)品的需求，兼容多樣化的結(jié)構(gòu)設(shè)計(jì)。\n\n 在QuecOpen?方案下，模塊可支持PWM以及ADC等接口，多種低功耗模式和長(zhǎng)連接?；?

Quectel

移遠(yuǎn)通信技術(shù)

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER (VOLTAGE RANGE 20 to 100 Volts CURRENT 2.0 Amperes)

文件：29.36 Kbytes 頁(yè)數(shù)：2 Pages

RECTRON

麗正國(guó)際

Silicon epitaxial planer type

Silicon epitaxialplaner type Features Plastic package has Underwrit ers Laboratory Flammability Classification 94V -O Ut iliz ing Flame Retardant Epox y M olding Compound. For surfac e mounted applications. Ex ceeds environmental standards of M IL-S- 19500 / 228 Low leakage cur

文件：68.83 Kbytes 頁(yè)數(shù)：2 Pages

FORMOSA

美麗微半導(dǎo)體

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

文件：33.91 Kbytes 頁(yè)數(shù)：3 Pages

RECTRON

麗正國(guó)際