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    首頁(yè) >FI2>規(guī)格書(shū)列表

    型號(hào)下載 訂購(gòu)功能描述制造商 上傳企業(yè)LOGO

    FI2

    FI Earth Leakage Circuit Breakers

    文件:111.9 Kbytes 頁(yè)數(shù):2 Pages

    ALTECH

    FI212B4150HW-T

    Multilayer Ceramic Devices (Band Pass Type)for 5G

    Features Item Summary Band Pass Type, 2.0x1.25x0.65mm for 5G Lifecycle Stage Mass Production (Preferred) Standard packaging quantity (minimum) Taping Embossed 5000pcs

    文件:299.86 Kbytes 頁(yè)數(shù):2 Pages

    TAIYO-YUDEN

    太陽(yáng)誘電

    FI212P0829H9-T

    Multilayer Ceramic Devices (Diplexers)for 5G

    Features Item Summary Diplexer, 2.0x1.25x1.0mm for LTE/5G Lifecycle Stage Mass Production (Preferred) Standard packaging quantity (minimum) Taping Embossed 5000pcs

    文件:331.61 Kbytes 頁(yè)數(shù):2 Pages

    TAIYO-YUDEN

    太陽(yáng)誘電

    FI212P0829JJ-T

    Multilayer Ceramic Devices (Diplexers)for 5G

    Features Item Summary Diplexer, 2.0x1.25x1.0mm for LTE/5G Lifecycle Stage Mass Production (Preferred) Standard packaging quantity (minimum) Taping Embossed 5000pcs

    文件:333.93 Kbytes 頁(yè)數(shù):2 Pages

    TAIYO-YUDEN

    太陽(yáng)誘電

    FI212P1700HU-T

    Multilayer Ceramic Devices (Diplexers)for 5G

    Features Item Summary Diplexer, 2.0x1.25x0.7mm for LTE/5G Lifecycle Stage Mass Production (Preferred) Standard packaging quantity (minimum) Taping Embossed 5000pcs

    文件:304.02 Kbytes 頁(yè)數(shù):2 Pages

    TAIYO-YUDEN

    太陽(yáng)誘電

    FI2WL0101009A

    Wi-Fi 6 OUTDOORAccess Point

    HIGHLIGHTS Wi-Fi Concurrentdual-band2.4and5GHz Wi-Fi 6 2x2:2 UL and DL MU-MIMO supporting up to 3 Gbps data rate Supportsupto32ESSIDs High-densityWi-Fideployment BluetoothLowEnergy(BLE) Physical ? Wall and pole mountable ? IP68 weatherproof plastic housing ? Industrial temperature ran

    文件:719.59 Kbytes 頁(yè)數(shù):5 Pages

    EDGE-CORE

    鈺登科技

    FI2WL1050001S

    INDOOR WI FI 7 ACCESS POINT

    HIGHLIGHTS ? Wi Fi 7 2x2 uplink and downlink MU MIMO with up to 9.34 Gbps data rate ? Enterprise grade wireless security ? 4G/5G cellular coexistence interference filter ? Support for OpenRoaming ? Bluetooth Low Energy ( and ZigBee support

    文件:459.25 Kbytes 頁(yè)數(shù):4 Pages

    EDGE-CORE

    鈺登科技

    FI2WLP111001E

    WI-FI 6 ACCESS POINT

    HIGHLIGHTS ? Wi-Fi 6 2x2 uplink and downlink MU-MIMO with up to 3 Gbps data rate ? Support OpenRoaming ? Support up to 32 ESSIDs ? Enterprise-Grade Wireless Security ? Bluetooth Low Energy (BLE) ? IP55 rating

    文件:419.31 Kbytes 頁(yè)數(shù):4 Pages

    EDGE-CORE

    鈺登科技

    FI2WLP111002E

    WI-FI 6 ACCESSPOINT

    HIGHLIGHTS ? Wi-Fi 6 2x2 uplink and downlink MU-MIMO with up to 3 Gbps data rate ? Support up to 32ESSIDs. ? Enterprise-Grade WirelessSecurity ? Bluetooth Low Energy (BLE)and ZigBeesupport ? IP55 rating

    文件:1.06288 Mbytes 頁(yè)數(shù):4 Pages

    EDGE-CORE

    鈺登科技

    FI2WLP112001E

    WI-FI 6IoT Gateway

    HIGHLIGHTS ? Wi-Fi 6 2x2 uplink and downlink MU-MIMO with up to 3 Gbps data rate ? Support OpenRoaming ? Wi-Fi HaLowfor long-range application and large-scale IoT network ? Support 4G LTE Cat 6 as the alternative uplink interface to the internet ? Support Bluetooth Low Energy (BLE),ZigBe

    文件:421.55 Kbytes 頁(yè)數(shù):5 Pages

    EDGE-CORE

    鈺登科技

    技術(shù)參數(shù)

    • System:

      PHS

    • 通帶頻率1 (f1):

      1884 to 1930 MHz

    • 插入損耗1 (max)(in f1):

      1.7 dB at 1884 to 1920MHz (+25 ℃)

    • 插入損耗2 (max)(in f1):

      2 dB at 1884 to 1920MHz (-30 to +85 ℃)

    • 插入損耗3 (max)(in f1):

      1.7 dB at 1920 to 1930MHz (+25 ℃)

    • 插入損耗4 (max)(in f1):

      2 dB at 1920 to 1930MHz (-30 to +85 ℃)

    • Ripple1 (max)(in f1):

      1 dB at 1884 to 1930MHz

    • VSWR1 (max)(in f1):

      2 at 1884 to 1930MHz

    • 衰減量1 (min)(f1):

      30 dB at 1420MHz

    • 衰減量2 (min)(f1):

      18 dB at 3768 to 3860MHz

    • 輸入阻抗:

      50 Ω

    • 輸出阻抗:

      50 Ω

    • 尺寸 (L):

      2.0 ±0.15 mm

    • 尺寸 (W):

      1.25 ±0.15 mm

    • 尺寸 (T):

      Max 1.0 mm

    • 使用溫度范圍:

      -30 to +85 ℃

    • RoHS Compliance (10 subst.):

      Yes

    • REACH Compliance (209 subst.):

      Yes

    • IEC62474 (Ver. D20.00) Compliance:

      Yes

    • Halogen Free:

      Yes

    • 適用焊接 方法:

      Reflow

    • 包裝:

      Taping Embossed 3000pcs

    供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
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    原廠原裝倉(cāng)庫(kù)現(xiàn)貨,歡迎咨詢(xún)
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    更多FI2供應(yīng)商 更新時(shí)間2026-1-22 8:31:00

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