Ultrafast Plastic Rectifier

FEATURES ? Glass passivated chip junction ? Ultrafast recovery time ? Low switching losses, high efficiency ? Low leakage current ? High forward surge capability ? Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) ? Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 頁數(shù)：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Ultrafast Plastic Rectifier

FEATURES ? Glass passivated chip junction ? Ultrafast recovery time ? Low switching losses, high efficiency ? Low leakage current ? High forward surge capability ? Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) ? Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 頁數(shù)：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

High Voltage Ultrafast Rectifier

FEATURES ? Glass passivated chip junction ? Ultrafast recovery time ? Soft recovery characteristics ? Low switching losses, high efficiency ? High forward surge capability ? Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) ? Solder dip 260 °C,

文件：144.25 Kbytes 頁數(shù)：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

High Voltage Ultrafast Rectifier

? Power pack ? Glass passivated chip junction ? Ultrafast recovery time ? Soft recovery characteristics ? Low switching losses, high efficiency ? High forward surge capability ? Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for D2PAK (TO-263AB package)) ? Solder dip 275 °C m

文件：142.81 Kbytes 頁數(shù)：5 Pages

VISHAYVishay Siliconix

威世威世科技公司