DUAL COOL??PACKAGE POWERTRENCH? MOSFETs

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：1.16337 Mbytes 頁數(shù)：2 Pages

FAIRCHILD

仙童半導(dǎo)體

N-Channel Dual CoolTM PowerTrench? MOSFET 30 V, 100 A, 0.99 m廓

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：252.88 Kbytes 頁數(shù)：8 Pages

FAIRCHILD

仙童半導(dǎo)體

N 溝道，雙 CoolTM 56 PowerTrench? MOSFET，30V，100A，0.99mΩ

此 N 溝道 MOSFET 采用飛兆半導(dǎo)體先進(jìn)的 PowerTrench?工藝生產(chǎn)。先進(jìn)的硅技術(shù)和 Dual Cool? 封裝技術(shù)完美融合，可在提供最小 rDS(on)的同時(shí)通過極低的結(jié)至環(huán)境熱阻保持卓越的開關(guān)性能。 ?Dual Cool? 頂側(cè)冷卻PQFN封裝\n?VGS = 10V，ID = 36A時(shí)，最大rDS(on) = 0.99mΩ\n?VGS = 4.5 V，ID = 32 A時(shí)，最大rDS(on) = 1.55mΩ\n?高性能溝道技術(shù)可實(shí)現(xiàn)極低的rDS(on)\n?符合 RoHS 標(biāo)準(zhǔn);

ONSEMI

安森美半導(dǎo)體

7.6 mm (0.3 inch)/10.9 mm (0.43 inch) Seven Segment Displays

Description The 7.6 mm (0.3 inch) and 10.9 mm (0.43 inch) LED seven segment displays are designed for viewing distances up to 3 metres (10 feet) and 5 metres (16 feet). These devices use an industry standard size package and pinouts. All devices are available as either common anode or common cath

文件：995.35 Kbytes 頁數(shù)：10 Pages

AVAGO

安華高

Intel? Pentium? M/Celeron?M/ ULV Intel? Celeron? M processor PCI-ISA/ISA Bus Single Board Computer

文件：2.07426 Mbytes 頁數(shù)：54 Pages

BOSER

寶晟科技

Intel? Pentium? M/Celeron?M/ ULV Intel? Celeron? M processor PCI-ISA/ISA Bus Single Board Computer

文件：2.07426 Mbytes 頁數(shù)：54 Pages

BOSER

寶晟科技