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          首頁 >FBP10>規(guī)格書列表

          型號(hào)下載 訂購(gòu)功能描述制造商 上傳企業(yè)LOGO

          FBP10

          1.5A BRIDGE RECTIFIER

          文件:84.02 Kbytes 頁數(shù):2 Pages

          ZSELEC

          淄博圣諾

          FBP100505U100-2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.25A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.5A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U121-2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U221-0.7A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U221-1A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U600-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U601-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
          FUJI
          22+
          MOLD
          8000
          原裝正品支持實(shí)單
          詢價(jià)
          DIGISOUND
          2447
          SMD
          100500
          一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
          詢價(jià)
          INFINEON
          NEW
          原廠封裝
          7936
          代理全系列銷售,全新原裝正品,價(jià)格優(yōu)勢(shì),長(zhǎng)期供應(yīng),量大可訂
          詢價(jià)
          Phoenix/菲尼克斯
          23/24+
          3069883
          10864
          優(yōu)勢(shì)特價(jià) 原裝正品 全產(chǎn)品線技術(shù)支持
          詢價(jià)
          24+
          N/A
          54000
          一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
          詢價(jià)
          富士通高見澤
          2023+環(huán)?,F(xiàn)貨
          專業(yè)繼電器
          6800
          專注軍工、汽車、醫(yī)療、工業(yè)等方案配套一站式服務(wù)
          詢價(jià)
          AP
          24+
          QFN
          5000
          全現(xiàn)原裝公司現(xiàn)貨
          詢價(jià)
          AP
          QFN
          6688
          15
          現(xiàn)貨庫存
          詢價(jià)
          CYSTECH/全宇昕
          23+
          WEFBP-03A
          89000
          原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
          詢價(jià)
          KEMET
          25+
          N/A
          18746
          樣件支持,可原廠排單訂貨!
          詢價(jià)
          更多FBP10供應(yīng)商 更新時(shí)間2026-1-19 16:42:00
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