ST portfolio for smartphone platforms

TYPICAL APPLICATIONS ? Contactless test factory automation and after sales services ? Life proof hole-less personal devices ? Contactless accessories ? Contactless personal equipment docking hub and data transfer KEY FEATURE ? True 10-finger multi touch ? High SNR, hign noise immunity ?

文件：3.51257 Mbytes 頁數(shù)：32 Pages

STMICROELECTRONICS

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ST portfolio for smartphone platforms

TYPICAL APPLICATIONS ? Contactless test factory automation and after sales services ? Life proof hole-less personal devices ? Contactless accessories ? Contactless personal equipment docking hub and data transfer KEY FEATURE ? True 10-finger multi touch ? High SNR, hign noise immunity ?

文件：3.51257 Mbytes 頁數(shù)：32 Pages

STMICROELECTRONICS

意法半導(dǎo)體

ST portfolio for smartphone platforms

TYPICAL APPLICATIONS ? Contactless test factory automation and after sales services ? Life proof hole-less personal devices ? Contactless accessories ? Contactless personal equipment docking hub and data transfer KEY FEATURE ? True 10-finger multi touch ? High SNR, hign noise immunity ?

文件：3.51257 Mbytes 頁數(shù)：32 Pages

STMICROELECTRONICS

意法半導(dǎo)體

絲?。?a target="_blank" title="Marking" href="/mk/marking.html">MK；Package：UQFN-10L；Common mode filter with ESD protection for high speed serial interface

Features ? 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc. ? High common mode attenuation on WLAN frequencies: – -15 dB at 2.4 GHz – -21 dB at 5.0 GHz – -17 dB at 6.0 GHz ? Low serial resistance: 3.0 Ω ?

文件：6.49812 Mbytes 頁數(shù)：17 Pages

STMICROELECTRONICS

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7th Gen Intel? Core ? Processor i7/i5/i3 3.5”Micro Module with Intel? QM175 Chipset

Features ? Onboard 7th Gen Intel? Core? i7/i5/i3 BGA Processor ? 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2400 SDRAM (Non-ECC) ? Dual-channel 18/24-bit LVDS, HDMI ? Supports Triple Display (LVDS, 2 x HDMI) ? 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB

文件：382.7 Kbytes 頁數(shù)：1 Pages

BCM

7th Gen Intel? Core ? Processor i7/i5/i3 3.5”Micro Module with Intel? QM175 Chipset

Features ? Onboard 7th Gen Intel? Core? i7/i5/i3 BGA Processor ? 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2400 SDRAM (Non-ECC) ? Dual-channel 18/24-bit LVDS, HDMI ? Supports Triple Display (LVDS, 2 x HDMI) ? 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB

文件：382.7 Kbytes 頁數(shù)：1 Pages

BCM

7th Gen Intel? Core ? Processor i7/i5/i3 3.5”Micro Module with Intel? QM175 Chipset

Features ? Onboard 7th Gen Intel? Core? i7/i5/i3 BGA Processor ? 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2400 SDRAM (Non-ECC) ? Dual-channel 18/24-bit LVDS, HDMI ? Supports Triple Display (LVDS, 2 x HDMI) ? 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB

文件：382.7 Kbytes 頁數(shù)：1 Pages

BCM

7th Gen Intel? Core ? Processor i7/i5/i3 3.5”Micro Module with Intel? QM175 Chipset

Features ? Onboard 7th Gen Intel? Core? i7/i5/i3 BGA Processor ? 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2400 SDRAM (Non-ECC) ? Dual-channel 18/24-bit LVDS, HDMI ? Supports Triple Display (LVDS, 2 x HDMI) ? 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB

文件：382.7 Kbytes 頁數(shù)：1 Pages

BCM

7th Gen Intel? Kaby Lake-U Processor 3.5” Micro Module

Features ? Top Layer Soldered Processor ? Single DRAM Socket, Max. Up to 16GB DDR4 2133MT/s ? Triple Display (Dual HDMI, Dual-Ch 18/24-bit LVDS) ? Dual Expansion Slot, M.2 Key-B, Full Size mCPIe ? Dual Gigabit Ethernet, HD Audio Code ? TPM 2.0

文件：415.97 Kbytes 頁數(shù)：1 Pages

BCM

7th Gen Intel? Kaby Lake-U Processor 3.5” Micro Module

Features ? Top Layer Soldered Processor ? Single DRAM Socket, Max. Up to 16GB DDR4 2133MT/s ? Triple Display (Dual HDMI, Dual-Ch 18/24-bit LVDS) ? Dual Expansion Slot, M.2 Key-B, Full Size mCPIe ? Dual Gigabit Ethernet, HD Audio Code ? TPM 2.0

文件：415.97 Kbytes 頁數(shù)：1 Pages

BCM