DRA821U2...ALM中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

1 Features

Processor cores:

? Dual 64-bit Arm? Cortex?-A72 microprocessor

subsystem at up to 2.0 GHz, 24K DMIPS

– 1MB L2 shared cache per dual-core Cortex?-

A72 cluster

– 32KB L1 DCache and 48KB L1 ICache per A72

core

? 4× Arm? Cortex?-R5F MCUs at up to 1.0 GHz with

optional lockstep operation, 8K DMIPS

– 32K I-Cache, 32K D-Cache, 64K L2 TCM

– 2× Arm? Cortex?-R5F MCUs in isolated MCU

subsystem

– 2× Arm? Cortex?-R5F MCUs in general

compute partition

Memory subsystem:

? 1MB of On-Chip L3 RAM with ECC and coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

? External Memory Interface (EMIF) module with

ECC

– Supports LPDDR4 memory types that comply

with the JESD209-4B specification. (No support

for byte mode LPDDR4 memories, or memories

with more than 17 row address bits)

– Supports speeds up to 3200 MT/s

– 32-bit and 16-bit data bus with inline ECC bus

up to 12.8GB/s

? General-Purpose Memory Controller (GPMC)

? 512KB on-chip SRAM in MAIN domain, protected

by ECC

Virtualization:

? Hypervisor support in Arm? Cortex?-A72

? Independent processing subsystems with Arm?

Cortex?-A72, Arm? Cortex?-R5F with isolated

safety MCU island

? IO virtualization support

– Peripheral Virtualization Unit (PVU) for low

latency high bandwidth peripheral traffic

? Multi-region firewall support for memory and

peripheral isolation

? Virtualization support with Ethernet, PCIe, and

DMA

? Device security (on select part numbers):

? Secure boot with secure runtime support

? Customer programmable root key, up to RSA-4K

or ECC-512

? Embedded hardware security module

? Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

Functional Safety:

? Functional Safety-Compliant targeted (on select

part numbers)

– Developed for functional safety applications

– Documentation will be available to aid ISO

26262 and IEC 61508 functional safety system

design up to ASIL-D/SIL-3 targeted

– Systematic capability up to ASIL-D/SIL-3

targeted

– Hardware integrity up to ASIL-D/SIL-3 targeted

for MCU Domain

– Hardware integrity up to ASIL-D/SIL-3 targeted

for Extended MCU (EMCU) portion of the Main

Domain

– Hardware integrity up to ASIL-B/SIL-2 targeted

for remainder of the Main Domain

– FFI isolation provided between EMCU and the

remainder of the Main Domain

– Safety-related certification

? ISO 26262 and IEC 61508 planned

? AEC-Q100 qualified on part number variants

ending in Q1

? High-speed interfaces:

– Integrated Ethernet TSN/AVB switch supporting

up to 4 (DRA821U4) or 2 (DRA821U2) external

ports:

? One port supports 5Gb, 10Gb USXGMII/XFI

? All ports support 2.5Gb SGMII

? All ports support 1Gb SGMII/RGMII

? DRA821U4: Any single port can support

QSGMII (using all 4 internal ports)

? Non-blocking wire-rate store and forward

switch

? InterVLAN (Layer3) routing support

? Time synchronization support with IEEE

1588(annex D,E,F)

? TSN/AVB support for traffic scheduling,

shaping

? Port mirroring feature for debug and

diagnostics

? Policing and rate limiting support

– One RGMII/RMII port in safety MCU island

? One PCI-Express? Gen3 controller

– Gen1, Gen2, and Gen3 operation with autonegotiation

– 4× lanes

? One USB 3.1 Gen1 dual-role device subsystem

– Supports type-C switching

– Independently configurable as USB host, USB

peripheral, or USB dual-role device

Automotive interfaces:

? Twenty CAN-FD ports

? 12× Universal Asynchronous Receiver/Transmitter

(UART)

? 11× Serial Peripheral Interfaces (SPI)

? One 8-channel ADC

? 10× Inter-Integrated Circuit ( I2C?)

? 2× Improved Inter-Integrated Circuit ( I3C?)

Audio interfaces:

? 3× Multichannel Audio Serial Port (McASP)

modules

Flash memory interfaces:

? Embedded Multi Media Card ( eMMC? 5.1)

interface

– Support speeds of up to HS400

? One Secure Digital? 3.0/Secure Digital Input

Output 3.0 (SD3.0/SDIO3.0) interfaces

? One Octal SPI / Xccela? / HyperBus? Memory

Controller (HBMC) interface

? 16-nm FinFET technology

? 17.2 mm x 17.2 mm, 0.8 mm pitch, IPC Class 3

PCB

2 Applications

? Automotive gateway

? Vehicle compute

? Body control module

? Telematics control unit

? V2X/V2V

? Factory automation gateways

? Communications equipment

? Industrial transport

? Building Automation Gateway

3 Description

Jacinto? DRA821x processors, based on the Armv8 64-bit architecture, are optimized for gateway systems

with cloud connectivity. The System-on-Chip (SoC) design reduces system-level costs and complexity through

integration—notably, a system MCU, functional safety and security features, and an Ethernet switch for highspeed

communication. Integrated diagnostics and functional safety features are targeted to ASIL-D and SIL 3

certification requirements. Real-time control and low-latency communication are enabled by a PCIe controller

and a TSN capable Gigabit Ethernet switch.

Up to four general-purpose Arm? Cortex?-R5F subsystems can handle low-level, timing-critical processing

tasks and leave the Arm? Cortex?-A72 core unencumbered for advanced and cloud-based applications.

Jacinto DRA821x processors also include the concept of the Extended MCU (eMCU) domain. This domain is a

subset of the processors and peripherals on the main domain targeted at higher functional safety enablement,

such as ASIL-D/SIL-3. The functional block diagram highlights which IP are included in the eMCU. For more

details about eMCU and functional safety, see the DRA821 Safety Manual Processors Texas Instruments

Jacinto? 7 Family of Products (SPRUIX4).