ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

絲?。?a target="_blank" title="Marking" href="/dei1070a/dmb/marking.html">DEI1070A/DMB；Package：8LSBDIP；ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

絲?。?a target="_blank" title="Marking" href="/dei1070a/dms/marking.html">DEI1070A/DMS；Package：8LSBDIP；ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

絲印：DE1070A/ES；Package：8LEPSOICG；ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

絲?。?a target="_blank" title="Marking" href="/de1070a/mb/marking.html">DE1070A/MB；Package：8LEPSOICG；ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

絲?。?a target="_blank" title="Marking" href="/de1070a/ms/marking.html">DE1070A/MS；Package：8LEPSOICG；ARINC 429 LINE DRIVER FAMILY

文件：315.15 Kbytes 頁數(shù)：12 Pages

DEIAZ

Line Drivers

The DEI107xA is a family of 8 pin bipolar integrated circuit line drivers which directly drive the ARINC 429 avionics serial digital data bus. These ARINC 429 Line Drivers convert TTL/CMOS serial input data to the “Trilevel RZ bipolar differential modulation format” of the ARINC bus. The output slew ? TTL/CMOS to ARINC 429 Line Driver\n? HI/LO Speed Control Pin for Hi (100KBS) or Lo (12.5KBS) speed slew rates\n? ±9.5V to ±16.5V supplies\n? Drives full ARINC load\n? Output resistor options: 0, 10 or 37.5 Ohms\n? Tristate Output options\n? 8 lead SOICN package with exposed pad for thermal enhance;

DEI

Line Drivers

The DEI107xA is a family of 8 pin bipolar integrated circuit line drivers which directly drive the ARINC 429 avionics serial digital data bus. These ARINC 429 Line Drivers convert TTL/CMOS serial input data to the “Trilevel RZ bipolar differential modulation format” of the ARINC bus. The output slew ? TTL/CMOS to ARINC 429 Line Driver\n? HI/LO Speed Control Pin for Hi (100KBS) or Lo (12.5KBS) speed slew rates\n? ±9.5V to ±16.5V supplies\n? Drives full ARINC load\n? Output resistor options: 0, 10 or 37.5 Ohms\n? Tristate Output options\n? 8 lead SOICN package with exposed pad for thermal enhance;

DEI

Line Drivers

DEI