Bluetooth Low Energy 4.2 SoC with FLASH

Features ? Complies to Bluetooth v4.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ? Flexible processing power ? 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 with 4-way associative cache ? Three optimised power modes (Extended sleep, Deep slee

文件：5.6731 Mbytes 頁數(shù)：440 Pages

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Bluetooth Low Energy 4.2 SoC FINAL

General description The DA14681 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14681 is based on an ARM? Cortex?-M0 CPU d

文件：5.71343 Mbytes 頁數(shù)：445 Pages

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Bluetooth Low Energy 5.0 SoC with Enhanced Security and FLASH FINAL

General description The DA14682 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14682 is based on an Arm? Cortex?-M0 CPU d

文件：4.38524 Mbytes 頁數(shù)：460 Pages

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Bluetooth Low Energy 5.0 SoC with Enhanced Security

General description The DA14683 is a flexible System-on-Chip combining an application processor, memories, cryptography engine, power management unit, digital and analog peripherals and a Bluetooth Low Energy MAC engine and radio transceiver. The DA14683 is based on an ARM? Cortex?-M0 CPU d

文件：9.88203 Mbytes 頁數(shù)：469 Pages

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SmartBond Bluetooth? LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth? 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

文件：1.8526 Mbytes 頁數(shù)：49 Pages

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SmartBond Bluetooth? LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth? 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

文件：1.8526 Mbytes 頁數(shù)：49 Pages

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SmartBond Bluetooth? LE 5.2 Module

■ Bluetooth □ Compatible with Bluetooth? 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) □ Supports up to eight connections □ Supports up to 2 Mbps throughput □ Renesas registered BD address preprogrammed in OTP ■ Processing and memori

文件：1.8526 Mbytes 頁數(shù)：49 Pages

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Multi-Core Bluetooth? 5.2 SoC Family with System PMU

Key Features ■ Compatible with Bluetooth? 5.2, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STDT66 (Japan) ■ Flexible processing power □ 32 kHz up to 96 MHz 32-bit Arm Cortex- M33 with 16 kB, 4-way associative cache and FPU □ A flexible and configurable

文件：9.09759 Mbytes 頁數(shù)：757 Pages

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The most integrated and flexible Bluetooth? low energy SoC

文件：576.05 Kbytes 頁數(shù)：5 Pages

DIALOGDialog Semiconductor

戴樂格

The most integrated and flexible Bluetooth? low energy SoC

文件：576.05 Kbytes 頁數(shù)：5 Pages

DIALOGDialog Semiconductor

戴樂格