Revision History

1 V3.3 (30-Dec-2021) ? Updated logo, disclaimer, copyright. 2 V3.2 (17-Jan-2017) ? Features (p.1): ? Added Ultra-Thin WLCSP34 package (nominal thickness: 0.334 mm). ? Section 3 (Ordering Information), p.7: ? Added part number for Ultra-Thin WLCSP34: DA14581-00000VRA. ? Section 7.4 (Package

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Low Power Bluetooth Smart SoC with optimized boot time

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

The go-to solution for A4WP & HCI\nDA14581 is the world’s smallest, lowest power and most integrated Bluetooth? low energy solution for A4WP wireless charging and HCI applications. SmartBond? DA14581 is an optimized version of the outstanding DA14580 SoC. A fast boot time for the Power Receiving Uni ·Bluetooth 4.2\n·Cortex M0 application processor\n·Power supply 0.9 – 3.6 V\n·Single pin RF I/O\n·Rich set of analog and digital peripherals\n·8 connections\n·Optimized boot time\n·Supporting software upgrades Over-The-Air (OTA);

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

文件：1.16074 Mbytes 頁數(shù)：153 Pages

DIALOGDialog Semiconductor

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

文件：1.16074 Mbytes 頁數(shù)：153 Pages

DIALOGDialog Semiconductor

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

文件：1.16074 Mbytes 頁數(shù)：153 Pages

DIALOGDialog Semiconductor

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

文件：1.16074 Mbytes 頁數(shù)：153 Pages

DIALOGDialog Semiconductor

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Bluetooth Low Energy 4.2 SoC with Optimized Boot Time

文件：1.16074 Mbytes 頁數(shù)：153 Pages

DIALOGDialog Semiconductor

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Package：40-VFQFN 裸露焊盤；包裝：管件 類別：RF/IF，射頻/中頻和 RFID 射頻收發(fā)器 IC 描述：IC RF TXRX+MCU BLUETOOTH 40VFQFN

Dialog Semiconductor GmbH

Package：40-VFQFN 裸露焊盤；包裝：卷帶（TR） 類別：RF/IF，射頻/中頻和 RFID 射頻收發(fā)器 IC 描述：IC RF TXRX+MCU BLUETOOTH 40VFQFN

Dialog Semiconductor GmbH