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          首頁(yè) >DA14531>規(guī)格書(shū)列表

          型號(hào)下載 訂購(gòu)功能描述制造商 上傳企業(yè)LOGO

          DA14531

          Ultra Low Power Bluetooth 5.1 SoC

          Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac

          文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          DA14531

          SmartBond? Ultra-Low Power Bluetooth? 5.1 System-on-Chip

          SmartBond TINY?, the world’s smallest and lowest power Bluetooth? 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at t ? Future proof, compliant with Bluetooth 5.1 (core)\n? Optimized for disposable products in connected medical, connected consumer? Designed to work with disposable, even printed batteries\n? Works well with smallest capacity batteries, <30mAh\n? Supports multiple years of shelf life\n? Inrush curren;

          Renesas

          瑞薩

          DA14531-00000FX2

          Ultra Low Power Bluetooth 5.1 SoC

          Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac

          文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          DA14531-00000OG2

          Ultra Low Power Bluetooth 5.1 SoC

          Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac

          文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          DA14531MOD

          SmartBond TINY Bluetooth? LE Module

          ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co

          文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages

          RENESAS

          瑞薩

          DA14531MOD-00F01002

          SmartBond TINY Bluetooth? LE Module

          ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co

          文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages

          RENESAS

          瑞薩

          DA14531MOD-00F0100C

          SmartBond TINY Bluetooth? LE Module

          ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co

          文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages

          RENESAS

          瑞薩

          DA14531MOD

          SmartBond TINYTM Module

          文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          DA14531MOD-00F01002

          SmartBond TINYTM Module

          文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          DA14531MOD-00F0100C

          SmartBond TINYTM Module

          文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages

          DIALOGDialog Semiconductor

          戴樂(lè)格

          技術(shù)參數(shù)

          • Wireless Standard:

            BLE 5.1 Core specification

          • Proprietary 2G4 protocol:

            No

          • CPU:

            M0+

          • Flash Memory (KB):

            0

          • ROM (KB):

            144

          • Memory Size (OTP) (KB):

            32

          • RAM (KB):

            48

          • GPIOs (#):

            12

          • Supply Voltage Vcc Range:

            1.1-3.6

          • Integrated DCDC:

            Integrated Buck/Boost DC-DC converter

          • Integrated Battery Charger:

            No

          • Tx Current (mA):

            3.5

          • Rx current (mA):

            2.2

          • Output Power Range (dBm):

            2.5

          • Sensitivity (dBm) (dBm):

            -94

          • Clock Rate (MHz):

            16

          • Flexible System Clock:

            是的

          • Execute from FLASH:

          • Hardware Crypto Engine:

            是的

          • SPI (#):

            1

          • I2C (#):

            1

          • UART (#):

            2

          • ADC:

            4ch 10b

          • USB Ports (#):

            0

          • LE Data Length Extensions:

            Supported

          • Pkg. Type:

            FCGQFN

          供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
          DIALOG/RENESAS
          24+
          WFQFN24
          98671
          專(zhuān)業(yè)代理藍(lán)牙芯片原裝現(xiàn)貨
          詢(xún)價(jià)
          Dialog Semiconductor GmbH
          25+
          封裝
          500000
          源自原廠成本,高價(jià)回收工廠呆滯
          詢(xún)價(jià)
          IDT/RENESAS
          25+
          VFBGA
          24500
          瑞薩全系列在售
          詢(xún)價(jià)
          Dialog Semiconductor
          20+
          WLCSP-17
          29860
          RF片上系統(tǒng)SOC-可開(kāi)原型號(hào)增稅票
          詢(xún)價(jià)
          DIALOG
          25+
          QFN40
          60000
          代理原裝現(xiàn)貨,價(jià)格優(yōu)勢(shì)。
          詢(xún)價(jià)
          DIALOG
          24+
          65300
          一級(jí)代理/放心購(gòu)買(mǎi)!
          詢(xún)價(jià)
          DIALOG
          2021+
          FCGQFN-24
          440000
          原裝正品現(xiàn)貨誠(chéng)信經(jīng)營(yíng)。
          詢(xún)價(jià)
          Dialog Semiconductor
          2447
          Module
          315000
          1000個(gè)/圓盤(pán)一級(jí)代理專(zhuān)營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,
          詢(xún)價(jià)
          Dialog Semiconductor
          2021+
          WLCSP17
          499
          詢(xún)價(jià)
          NA
          23+
          NA
          26094
          10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品,做服務(wù)型企業(yè)
          詢(xún)價(jià)
          更多DA14531供應(yīng)商 更新時(shí)間2026-1-18 9:01:00
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