| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
DA14531 | Ultra Low Power Bluetooth 5.1 SoC Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac 文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG | |
DA14531 | SmartBond? Ultra-Low Power Bluetooth? 5.1 System-on-Chip SmartBond TINY?, the world’s smallest and lowest power Bluetooth? 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at t ? Future proof, compliant with Bluetooth 5.1 (core)\n? Optimized for disposable products in connected medical, connected consumer? Designed to work with disposable, even printed batteries\n? Works well with smallest capacity batteries, <30mAh\n? Supports multiple years of shelf life\n? Inrush curren; | Renesas 瑞薩 | Renesas | |
Ultra Low Power Bluetooth 5.1 SoC Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac 文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG | ||
Ultra Low Power Bluetooth 5.1 SoC Features ■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■ Supports up to three BLE connections ■ Typical cold boot to radio active 35 ms ■ Processing power □ 16 MHz 32-bit Arm? Cortex-M0+ with SWD interfac 文件:4.80049 Mbytes 頁(yè)數(shù):374 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG | ||
SmartBond TINY Bluetooth? LE Module ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co 文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages | RENESAS 瑞薩 | RENESAS | ||
SmartBond TINY Bluetooth? LE Module ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co 文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages | RENESAS 瑞薩 | RENESAS | ||
SmartBond TINY Bluetooth? LE Module ? Bluetooth? ? Compatible with Bluetooth? v5.1, ? ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core ? Supports up to three connections ? Renesas registered BD address preprogrammed in OTP ? Processing and memories ? 16 MHz 32-bit Arm? Co 文件:2.44679 Mbytes 頁(yè)數(shù):35 Pages | RENESAS 瑞薩 | RENESAS | ||
SmartBond TINYTM Module 文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG | ||
SmartBond TINYTM Module 文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG | ||
SmartBond TINYTM Module 文件:2.15323 Mbytes 頁(yè)數(shù):32 Pages | DIALOGDialog Semiconductor 戴樂(lè)格 | DIALOG |
技術(shù)參數(shù)
- Wireless Standard:
BLE 5.1 Core specification
- Proprietary 2G4 protocol:
No
- CPU:
M0+
- Flash Memory (KB):
0
- ROM (KB):
144
- Memory Size (OTP) (KB):
32
- RAM (KB):
48
- GPIOs (#):
12
- Supply Voltage Vcc Range:
1.1-3.6
- Integrated DCDC:
Integrated Buck/Boost DC-DC converter
- Integrated Battery Charger:
No
- Tx Current (mA):
3.5
- Rx current (mA):
2.2
- Output Power Range (dBm):
2.5
- Sensitivity (dBm) (dBm):
-94
- Clock Rate (MHz):
16
- Flexible System Clock:
是的
- Execute from FLASH:
否
- Hardware Crypto Engine:
是的
- SPI (#):
1
- I2C (#):
1
- UART (#):
2
- ADC:
4ch 10b
- USB Ports (#):
0
- LE Data Length Extensions:
Supported
- Pkg. Type:
FCGQFN
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
DIALOG/RENESAS |
24+ |
WFQFN24 |
98671 |
專(zhuān)業(yè)代理藍(lán)牙芯片原裝現(xiàn)貨 |
詢(xún)價(jià) | ||
Dialog Semiconductor GmbH |
25+ |
封裝 |
500000 |
源自原廠成本,高價(jià)回收工廠呆滯 |
詢(xún)價(jià) | ||
IDT/RENESAS |
25+ |
VFBGA |
24500 |
瑞薩全系列在售 |
詢(xún)價(jià) | ||
Dialog Semiconductor |
20+ |
WLCSP-17 |
29860 |
RF片上系統(tǒng)SOC-可開(kāi)原型號(hào)增稅票 |
詢(xún)價(jià) | ||
DIALOG |
25+ |
QFN40 |
60000 |
代理原裝現(xiàn)貨,價(jià)格優(yōu)勢(shì)。 |
詢(xún)價(jià) | ||
DIALOG |
24+ |
65300 |
一級(jí)代理/放心購(gòu)買(mǎi)! |
詢(xún)價(jià) | |||
DIALOG |
2021+ |
FCGQFN-24 |
440000 |
原裝正品現(xiàn)貨誠(chéng)信經(jīng)營(yíng)。 |
詢(xún)價(jià) | ||
Dialog Semiconductor |
2447 |
Module |
315000 |
1000個(gè)/圓盤(pán)一級(jí)代理專(zhuān)營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨, |
詢(xún)價(jià) | ||
Dialog Semiconductor |
2021+ |
WLCSP17 |
499 |
詢(xún)價(jià) | |||
NA |
23+ |
NA |
26094 |
10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品,做服務(wù)型企業(yè) |
詢(xún)價(jià) |
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