| 型號 | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
絲?。?strong>CP7；Package：SOD-123；Zener Voltage Regulators 500 mW SOD-123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD?123 package. These devices provide a convenient alternative to the leadless 34?package style. Specification Features ? 500 mW Rating on FR?4 or FR?5 Board ? Wide Zener Reverse Voltage Range ? 2.4 文件：157.7 Kbytes 頁數(shù)：6 Pages | ONSEMI 安森美半導(dǎo)體 | ONSEMI | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
Small Signal Transistors PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：68.71 Kbytes 頁數(shù)：1 Pages | CENTRAL | CENTRAL | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
Small Signal Transistors NPN - Amp Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.7 X 3.7 MILS Emitter Bonding Pad Area 4.2 X 4.2 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：133.98 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES ? arcTEC? structure on select models ? solid state device ? precise temperature control ? quiet operation 文件：723.27 Kbytes 頁數(shù)：8 Pages | CUI | CUI | ||
Small Signal Transistors PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 4.2 x 4.2 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：475.62 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
ONSEMICONDU |
24+ |
原裝進(jìn)口原廠原包接受訂貨 |
75000 |
原裝現(xiàn)貨假一罰十 |
詢價(jià) | ||
ON/安森美 |
25+ |
電聯(lián)咨詢 |
7800 |
公司現(xiàn)貨,提供拆樣技術(shù)支持 |
詢價(jià) | ||
onsemi |
25+ |
SOD-123 |
18746 |
樣件支持,可原廠排單訂貨! |
詢價(jià) | ||
onsemi |
25+ |
SOD-123 |
18798 |
正規(guī)渠道,免費(fèi)送樣。支持賬期,BOM一站式配齊 |
詢價(jià) | ||
ON |
1710+ |
SOD-123 |
6600 |
只做原裝進(jìn)口,假一罰十 |
詢價(jià) | ||
ONSemiconductor |
24+ |
NA |
3000 |
進(jìn)口原裝正品優(yōu)勢供應(yīng) |
詢價(jià) | ||
ON |
25+23+ |
SOD-123 |
28589 |
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨 |
詢價(jià) | ||
三年內(nèi) |
1983 |
只做原裝正品 |
詢價(jià) | ||||
ON |
20+ |
SMD |
11520 |
特價(jià)全新原裝公司現(xiàn)貨 |
詢價(jià) | ||
ON Semiconductor |
2010+ |
N/A |
789 |
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