| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
BM57 | Low-Profile Hybrid FPC-to-Board Connector Supporting 5A Features 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and 文件：554.83 Kbytes 頁(yè)數(shù)：1 Pages | HIROSEHirose Electric Company 廣瀨日本廣瀨電機(jī)株式會(huì)社 | HIROSE | |
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A Features 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and 文件：554.83 Kbytes 頁(yè)數(shù)：1 Pages | HIROSEHirose Electric Company 廣瀨日本廣瀨電機(jī)株式會(huì)社 | HIROSE | ||
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A Features 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and 文件：554.83 Kbytes 頁(yè)數(shù)：1 Pages | HIROSEHirose Electric Company 廣瀨日本廣瀨電機(jī)株式會(huì)社 | HIROSE | ||
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A Features 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and 文件：554.83 Kbytes 頁(yè)數(shù)：1 Pages | HIROSEHirose Electric Company 廣瀨日本廣瀨電機(jī)株式會(huì)社 | HIROSE | ||
Low-Profile Hybrid FPC-to-Board Connector Supporting 5A Features 1 Low-profile design with high power supply capacity - Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width 2 Full armored design prevents housing damage 3 Easy mating operation with wide self alignment range 4 Insert molded header and 文件：554.83 Kbytes 頁(yè)數(shù)：1 Pages | HIROSEHirose Electric Company 廣瀨日本廣瀨電機(jī)株式會(huì)社 | HIROSE | ||
Bluetooth module is designed for both MFi The BM57SPP05MC2 Bluetooth module is designed for both MFi (The Made for iPod, Made for iPhone and Made for iPad logos) iOS App Enabled Accessory and Bluetooth 3.0 Std. SPP for other OSs App Accessory via Bluetooth connectivity. For purchasing the module, the external Apple authentication coprocesso ? Bluetooth 3.0 + EDR\n? RF transmitter output power Class 2\n? - GFSK typical -90dBm, \n? - 8DPSK typical -83dBm\n? I2C for external EEPROM and authentication chip (to enable functionality between your appcessory and the iPod, iPhone and iPad)\n? 1 LED driver; | Microchip 微芯科技 | Microchip | ||
Bluetooth 3.0 std. SPP module The BM57SPPS3MC2 Bluetooth module is designed for Bluetooth 3.0 Std. SPP (Serial Port Profile) appcessory via Bluetooth connectivity.\n\nIt is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR.\n\nIS1657S (M) single chip solution combines ? Bluetooth 3.0 + EDR\n? RF transmitter output power Class 2\n? - GFSK typical -90dBm, \n? - 8DPSK typical -83dBm\n? I2C for external EEPROM\n? 1 LED driver\n; | Microchip 微芯科技 | Microchip | ||
連接器 | Hirose 廣瀨 | Hirose | ||
包裝：托盤(pán) 類別：連接器，互連器件 陣列，邊緣型，夾層式（板對(duì)板） 描述：CONN HDR 0.3MM SMD 10POS + 2PWR | Hirose Electric Co Ltd | Hirose Electric Co Ltd | ||
包裝：卷帶（TR） 類別：連接器，互連器件 陣列，邊緣型，夾層式（板對(duì)板） 描述：CONN RCPT 0.3MM SMD 10POS + 2PWR | Hirose Electric Co Ltd | Hirose Electric Co Ltd |
技術(shù)參數(shù)
- 開(kāi)口間距：
0.3 mm
- 安裝間距：
0.3 mm
- 嵌合高度(Min.)：
0.6 mm
- 嵌合高度(Max.)：
0.6 mm
- 嵌合高度：
0.6 mm
- PIN數(shù)：
10
- 插拔次數(shù)：
10
- 安裝方法：
SMT
- 接觸部電鍍：
金
- 額定電流：
5.0 A
- (AC)額定電壓：
AC 30.0 V
- (DC)額定電壓：
DC 30.0 V
- (Max.)使用溫度范圍：
85 ℃
- (Min.)使用溫度范圍：
-55 ℃
- RoHS2：
匹配
- SVHC：
27th 不含
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
ISSC |
20+ |
SMD |
56200 |
原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開(kāi)原型號(hào)增稅票 |
詢價(jià) | ||
MICROCHIP/微芯 |
23+ |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價(jià) | |||
23+ |
BGA |
3000 |
一級(jí)代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、 |
詢價(jià) | |||
N/A |
26+ |
SOT-23 |
86720 |
全新原裝正品價(jià)格最實(shí)惠 假一賠百 |
詢價(jià) | ||
MICROCHIP/微芯 |
2023+ |
MOD |
1499 |
一級(jí)代理優(yōu)勢(shì)現(xiàn)貨,全新正品直營(yíng)店 |
詢價(jià) | ||
ISSC |
23+ |
SMD |
8650 |
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣! |
詢價(jià) | ||
ISSC |
25+ |
SMD |
880000 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價(jià) | ||
MICROCHIP |
23+ |
14 |
8000 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價(jià) | ||
ADI |
23+ |
7000 |
詢價(jià) | ||||
N/A |
25+ |
NA |
469 |
原裝正品,假一罰十! |
詢價(jià) |
相關(guān)規(guī)格書(shū)
更多- COS5532
- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532-TD
- NE5532NB
- MAX232
- MAX232
- MAX232
- MAX232A
- MAX2323
- MAX2326
- MAX2327
- MAX232E
- MAX232E
- MAX232ESE
- NE5533
- SI7970DP
- SI7958DP
- SI7913DN
- SI7942DP
- SI7911DN
- SI7900EDN
- SI7922DN
- SI7946DP
- SI7945DP
- SI7921DN
- SI7905DN
- SI7938DP
- SI7925DN
- SI7948DP
- SI7946ADP
- SE1
- PI7C8150B
- PI7C8150DNDE
- PERICOMPI7C8150
- WNS40H100C
- WNS40H100CB
- TD62308
- TD62308APG
- TD62308AFG
- GRM21BR71H104JA11#
- TL074
相關(guān)庫(kù)存
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532A
- UNE5532
- MAX232
- MAX232
- MAX232E
- MAX2325
- MAX2324
- MAX2321
- MAX2322
- MAX2320
- MAX232E-TD
- MAX232CPE
- SI7964DP
- SI7909DN
- SI7941DP
- SI7901EDN
- SI7940DP
- SI7956DP
- SI7980DP
- SI7902EDN
- SI7998DP
- SI7960DP
- SI7943DP
- SI7991DP
- SI7923DN
- SI7983DP
- SI7973DP
- SI7949DP
- SPC5605BF1MLQ6
- PI7C8150A
- PI7C8150DMAE
- XRCGB25M000F3N00R0
- WNS40H100CG
- MPC8540PX833LC
- TD62308BFG
- TD62308BP1G
- TD62308BF
- TL074
- TL074
