絲?。?strong>AKT；Package：DO-214AC；400W Surface Mount Transient Voltage Suppressors

Features Glass passivated or planar junction Excellent clamping capability Repetition rate (duty cycle): 0.01 Low profile package and low inductance 400W Peak Pulse power capability at 10×1000μs waveform Fast response time: typically less than 1.0ps from 0V to VBR min High temperature solde

文件：3.2336 Mbytes 頁數(shù)：7 Pages

UNSEMI

優(yōu)恩半導(dǎo)體

絲?。?strong>AKT；Package：DO-214AA；600W Surface Mount Transient Voltage Suppressors

Features Glass passivated or planar junction Excellent clamping capability Repetition rate (duty cycle): 0.01 Low profile package and low inductance 600W Peak Pulse power capability at 10×1000μs waveform Fast response time: typically less than 1.0ps from 0V to VBR min High temperature solde

文件：3.25781 Mbytes 頁數(shù)：7 Pages

UNSEMI

優(yōu)恩半導(dǎo)體

絲印：AKT；Package：TSOT23-8；3A, 1MHz, 22uA Iq, 5.5V Synchronous Step-Up Converter with Output Disconnect

文件：1.29815 Mbytes 頁數(shù)：17 Pages

MPS

美國芯源

絲?。?strong>AKT；Package：SMB；Surface Mount Transient Voltage Suppressors

文件：975.32 Kbytes 頁數(shù)：3 Pages

LUGUANG

魯光電子

絲?。?strong>AKT；Package：SMB；Surface Mount Transient Voltage Suppressors

文件：251.73 Kbytes 頁數(shù)：3 Pages

ANOVA

林朋科技

絲印：AKT；Package：DO-214AA；Surface Mount Transient Voltage Suppressors

文件：251.73 Kbytes 頁數(shù)：3 Pages

ANOVA

林朋科技

(SQUARE STEM WITH CAP OPTIONS) MECHANICAL CONTACT STYLE

FEATURES Positive tactile feedback. Ultraminiature structure suitable for high density mounting. Economic but high reliability. Insert molded terminals prevent flux build-up during soldering.

文件：237.58 Kbytes 頁數(shù)：5 Pages

APEM

埃斐

(SQUARE STEM WITH CAP OPTIONS) MECHANICAL CONTACT STYLE

FEATURES Positive tactile feedback. Ultraminiature structure suitable for high density mounting. Economic but high reliability. Insert molded terminals prevent flux build-up during soldering.

文件：237.58 Kbytes 頁數(shù)：5 Pages

APEM

埃斐

(SQUARE STEM WITH CAP OPTIONS) MECHANICAL CONTACT STYLE

FEATURES Positive tactile feedback. Ultraminiature structure suitable for high density mounting. Economic but high reliability. Insert molded terminals prevent flux build-up during soldering.

文件：237.58 Kbytes 頁數(shù)：5 Pages

APEM

埃斐

(SQUARE STEM WITH CAP OPTIONS) MECHANICAL CONTACT STYLE

FEATURES Positive tactile feedback. Ultraminiature structure suitable for high density mounting. Economic but high reliability. Insert molded terminals prevent flux build-up during soldering.

文件：237.58 Kbytes 頁數(shù)：5 Pages

APEM

埃斐