5.8GHz/5.2GHz 無線通信芯片

A1011 is 5.8GHz CPC SoC which integrates DSRC type-A, 1T and pipeline 8051. In DSRC part, it supports physical layer, framing and separated 256 Byte TRX FIFO. In MCU part, it integrates 64K Byte flash, 256 Byte internal data RAM and 8K Byte external data RAM.\n\nAll features are integrated in a QFN6 A1011 is 5.8GHz CPC SoC which integrates DSRC type-A, 1T and pipeline 8051. In DSRC part, it supports physical layer, framing and separated 256 Byte TRX FIFO. In MCU part, it integrates 64K Byte flash, 256 Byte internal data RAM and 8K Byte external data RAM.\nAll features are integrated in a QFN6x6;

Amiccom

笙科

Timers Delay on Operate

文件：72.92 Kbytes 頁數(shù)：3 Pages

ETCList of Unclassifed Manufacturers

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Timers Delay on Operate

文件：72.92 Kbytes 頁數(shù)：3 Pages

ETCList of Unclassifed Manufacturers

未分類制造商

Timers Delay on Operate

文件：72.92 Kbytes 頁數(shù)：3 Pages

ETCList of Unclassifed Manufacturers

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Thermally Conductive Insulators

文件：225.28 Kbytes 頁數(shù)：2 Pages

ETCList of Unclassifed Manufacturers

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Axial Leaded Multilayer Ceramic Capacitors for General Purpose Class 1, Class 2 and Class 3, 50 VDC, 100 VDC, 200 VDC, 500 VDC

文件：104.11 Kbytes 頁數(shù)：8 Pages

VISHAYVishay Siliconix

威世威世科技公司

SOLDERSLEEVE WIRE SPLICE

文件：89.77 Kbytes 頁數(shù)：1 Pages

PANDUIT

Silicone based Thermal Gap Filler

Laird

萊爾德

溫控開關(guān)

Cantherm

包裝：袋 類別：風(fēng)扇，熱管理 熱 - 墊，片 描述：THERM PAD 203.2MMX203.2MM W/ADH

Laird Technologies - Thermal Materials