| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
絲?。?a target="_blank" title="Marking" href="/97370m/marking.html">97370M；Package：LSON-CLIP；Synchronous Buck NexFET? Power Stage 1FEATURES ? 90% System Efficiency at 25A ? Input Voltages up to 22V ? High Frequency Operation (Up To 2MHz) ? Incorporates Power Block Technology ? High Density – SON 5-mm × 6-mm Footprint ? Low Power Loss 2.8W at 25A ? Ultra Low Inductance Package ? System Optimized PCB Footprint ? 3 文件：730.69 Kbytes 頁(yè)數(shù)：20 Pages | TI 德州儀器 | TI | ||
絲印：97374M；Package：VSON-CLIP(DPC)；CSD97374Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? Over 92% System Efficiency at 15 A ? Max Rated Continuous Current 25 A, Peak 60 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode 文件：661.62 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97374m/marking.html">97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? Over 92% System Efficiency at 15 A ? Max Rated Continuous Current 25 A, Peak 60 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode 文件：661.16 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲印：97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? Over 92% System Efficiency at 15 A ? Max Rated Continuous Current 25 A, Peak 60 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode 文件：661.16 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97374m/marking.html">97374M；Package：VSON-CLIP(DPC)；CSD97374Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? Over 92% System Efficiency at 15 A ? Max Rated Continuous Current 25 A, Peak 60 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode 文件：661.62 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97374m/marking.html">97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? Over 92% System Efficiency at 15 A ? Max Rated Continuous Current 25 A, Peak 60 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode 文件：661.16 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97376m/marking.html">97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? 90% System Efficiency at 15 A ? Max Rated Continuous Current 20 A, Peak 45 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode ? 3. 文件：665.23 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97376m/marking.html">97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? 90% System Efficiency at 15 A ? Max Rated Continuous Current 20 A, Peak 45 A ? High-Frequency Operation (up to 2 MHz) ? High-Density SON 3.5-mm x 4.5-mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode ? 3. 文件：665.23 Kbytes 頁(yè)數(shù)：23 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/97394m/marking.html">97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? 90% System Efficiency at 15 A ? Max Rated Continuous Current 20 A, Peak 45 A ? High Frequency Operation (up to 2 MHz) ? High Density – SON 3.5 × 4.5 mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode ? 3.3 文件：587.36 Kbytes 頁(yè)數(shù)：21 Pages | TI 德州儀器 | TI | ||
絲印：97394M；Package：VSON-CLIP；CSD97394Q4M Synchronous Buck NexFET? Power Stage 1 Features 1? 90% System Efficiency at 15 A ? Max Rated Continuous Current 20 A, Peak 45 A ? High Frequency Operation (up to 2 MHz) ? High Density – SON 3.5 × 4.5 mm Footprint ? Ultra-Low Inductance Package ? System Optimized PCB Footprint ? Ultra-Low Quiescent (ULQ) Current Mode ? 3.3 文件：587.36 Kbytes 頁(yè)數(shù)：21 Pages | TI 德州儀器 | TI |
產(chǎn)品屬性
- 產(chǎn)品編號(hào)：
973
- 制造商：
Keystone Electronics
- 類別：
連接器，互連器件 > 音頻連接器
- 包裝：
散裝
- 連接器類型：
音頻（RCA）插孔
- 公母：
母頭
- 信號(hào)線：
單聲道
- 業(yè)內(nèi)公認(rèn)的配接直徑：
3.20mm 內(nèi)徑，9.00mm 外徑（RCA）
- 實(shí)際直徑：
0.125"（3.18mm 內(nèi)徑），0.327"（8.31mm 外徑）
- 針位/觸頭數(shù)：
2 導(dǎo)線，3 觸點(diǎn)
- 內(nèi)部開(kāi)關(guān)：
單開(kāi)關(guān)
- 安裝類型：
通孔，直角
- 端接：
焊接
- 屏蔽：
無(wú)屏蔽
- 特性：
板鎖
- 絕緣顏色：
黃色
- 描述：
CONN RCA JACK MONO 3.2MM R/A
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
KeystoneElectronics |
24+ |
300 |
詢價(jià) | ||||
KEYSTONE |
2447 |
SMD |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
KEYSTONE |
25+ |
連接器 |
2963 |
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件! |
詢價(jià) | ||
ERNI |
16+ |
插件 |
8800 |
進(jìn)口原裝大量現(xiàn)貨熱賣中 |
詢價(jià) | ||
AMPH |
24+/25+ |
15 |
原裝正品現(xiàn)貨庫(kù)存價(jià)優(yōu) |
詢價(jià) | |||
PHI |
25+ |
QFP80 |
3629 |
原裝優(yōu)勢(shì)!房間現(xiàn)貨!歡迎來(lái)電! |
詢價(jià) | ||
WikaInstruments |
新 |
5 |
全新原裝 貨期兩周 |
詢價(jià) | |||
ERNI |
24+ |
SMD |
18700 |
詢價(jià) | |||
ERNI |
23+ |
NA |
284 |
專做原裝正品,假一罰百! |
詢價(jià) | ||
TI |
25+23+ |
QFN |
25316 |
絕對(duì)原裝正品全新進(jìn)口深圳現(xiàn)貨 |
詢價(jià) |
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