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          首頁 >935>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          935154632410-E1T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC632.410 0101 1nF BV50

          Compatible with MLCC footprint Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to+150 °C) o Voltage

          文件:1.17521 Mbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-E1T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

          ? Break down voltage 50V ? Low leakage current ? High reliability ? High operating temperature (up to 150 °C) ? Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) ? Compatible with EIA 0101+ footprint ? Applicable for standard wire bonding assem

          文件:758.61 Kbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-F1T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

          ? Break down voltage 50V ? Low leakage current ? High reliability ? High operating temperature (up to 150 °C) ? Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) ? Compatible with EIA 0101+ footprint ? Applicable for standard wire bonding assem

          文件:758.61 Kbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-F1T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC632.410 0101 1nF BV50

          Compatible with MLCC footprint Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to+150 °C) o Voltage

          文件:1.17521 Mbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-F1T_V01

          Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

          ? Break down voltage 50V ? Low leakage current ? High reliability ? High operating temperature (up to 150 °C) ? Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) ? Compatible with EIA 0101+ footprint ? Applicable for standard wire bonding assem

          文件:758.61 Kbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-F2T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

          ? Break down voltage 50V ? Low leakage current ? High reliability ? High operating temperature (up to 150 °C) ? Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) ? Compatible with EIA 0101+ footprint ? Applicable for standard wire bonding assem

          文件:758.61 Kbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-F2T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC632.410 0101 1nF BV50

          Compatible with MLCC footprint Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to+150 °C) o Voltage

          文件:1.17521 Mbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-W0T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

          ? Break down voltage 50V ? Low leakage current ? High reliability ? High operating temperature (up to 150 °C) ? Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) ? Compatible with EIA 0101+ footprint ? Applicable for standard wire bonding assem

          文件:758.61 Kbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154632410-W0T

          Ultra-Large band Wire Bondable Vertical SiCap UWSC632.410 0101 1nF BV50

          Compatible with MLCC footprint Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to+150 °C) o Voltage

          文件:1.17521 Mbytes 頁數(shù):10 Pages

          MURATA

          村田

          935154634522-XXT

          Ultra large band performance higher than 26GHz

          l Ultra large band performance higher than 26GHz l Resonance free and phase stability l Unique capacitance value of 1nF in 0101 l High stability of capacitance value over temperature, voltage and aging l Ultra low ESR and ESL and high reliability l Compatible with standard wire bonding assemb

          文件:177.51 Kbytes 頁數(shù):2 Pages

          MURATA

          村田

          產(chǎn)品屬性

          • 產(chǎn)品編號:

            935

          • 制造商:

            Klein Tools, Inc.

          • 類別:

            工具 > 專用工具

          • 包裝:

            散裝

          • 工具類型:

          • 配套使用/相關產(chǎn)品:

            測量

          • 描述:

            TORPEDO LEVEL

          供應商型號品牌批號封裝庫存備注價格
          KeystoneElectronics
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          公司存貨
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          ST
          10+
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          進口原裝現(xiàn)貨/價格優(yōu)勢!
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          只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
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          IPDIA
          23+
          電容
          8000
          原裝正品,假一罰十
          詢價
          更多935供應商 更新時間2026-1-21 16:05:00
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