2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

文件：481.36 Kbytes 頁數(shù)：9 Pages

MOLEX

莫仕

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

文件：481.07 Kbytes 頁數(shù)：9 Pages

MOLEX

莫仕

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

文件：481.07 Kbytes 頁數(shù)：9 Pages

MOLEX

莫仕

2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

文件：481.08 Kbytes 頁數(shù)：9 Pages

MOLEX

莫仕

2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

文件：481.08 Kbytes 頁數(shù)：9 Pages

MOLEX

莫仕

2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits

文件：106.56 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕

2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits

文件：115.11 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

文件：125.32 Kbytes 頁數(shù)：3 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關(guān)m (100關(guān)) Tin (Sn) Plating, 14.22mm (.560) Stacking Height

文件：196.13 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Plating, 25.60mm (1.043) Stacking Height

文件：260.99 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕