Heyco-Flex? Quick Twist Conduit Fittings

文件：136.68 Kbytes 頁數(shù)：1 Pages

HEYCO

包裝：散裝 類別：風(fēng)扇，熱管理 風(fēng)扇 - 護手板，濾波器和套管 描述：FAN GUARD 92MM

Keystone Electronics

包裝：袋 類別：五金件，緊固件，配件 旋鈕 描述：CT.476-P, WING KNOBS, ZINC-PLATE

Elesa USA Corporation

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：643.42 Kbytes 頁數(shù)：32 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM

ASSY, 1.00MM FFC CONN SMT, H

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：64.879 Kbytes 頁數(shù)：1 Pages

MACOM