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                >837>規(guī)格書(shū)列表
                
          
            
          
                
          
                    
          型號(hào)下載 訂購(gòu)功能描述制造商 上傳企業(yè)LOGO
          
                    
          837-007-523-602
          837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：294.02 Kbytes 頁(yè)數(shù)：4 Pages
          EDAC
          亞得電子
          

          837-007-523-602
          837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：124.53 Kbytes 頁(yè)數(shù)：2 Pages
          EDAC
          亞得電子
          

          837-007-523-603
          837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：294.02 Kbytes 頁(yè)數(shù)：4 Pages
          EDAC
          亞得電子
          

          837-007-523-603
          837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：126.17 Kbytes 頁(yè)數(shù)：2 Pages
          EDAC
          亞得電子
          

          837-007-523-604
          837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：294.02 Kbytes 頁(yè)數(shù)：4 Pages
          EDAC
          亞得電子
          

          837-007-523-604
          837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：124.59 Kbytes 頁(yè)數(shù)：2 Pages
          EDAC
          亞得電子
          

          837-007-523-607
          837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：124.84 Kbytes 頁(yè)數(shù)：2 Pages
          EDAC
          亞得電子
          

          837-007-523-607
          837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：294.02 Kbytes 頁(yè)數(shù)：4 Pages
          EDAC
          亞得電子
          

          837-007-523-608
          837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：294.02 Kbytes 頁(yè)數(shù)：4 Pages
          EDAC
          亞得電子
          

          837-007-523-608
          837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator
          
Features
0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing
Accepts .062 (1.57mm) Nominal Thickness P.C. Board
High Profile Insulator Body, .600 (15.24mm)
Card Slot Depth of .330 (8.38mm)
Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend
          文件：125.04 Kbytes 頁(yè)數(shù)：2 Pages
          EDAC
          亞得電子
          

          
            
          
		
        
          
            
          
                
          產(chǎn)品屬性
          
            
          
            
            
            	
          • 產(chǎn)品編號(hào)：
            837
          • 制造商：
            Adafruit Industries LLC
          • 類(lèi)別：
            計(jì)算機(jī)設(shè)備 > 計(jì)算機(jī)鼠標(biāo)，軌跡球
          • 包裝：
            散裝
          • 接口：
            PS/2
          • 描述：
            TRACKPAD CAP MCU-FRIENDLY PS/2
          
            
          
        
          
            
          供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
          
                
          



          TI/德州儀器
          		

          24+
          		

          WSON8
          		

          4290
          		

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詢價(jià)
          

          



          Master
          		

          1931+
          		

          N/A
          		

          567
          		

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          WINBOND
          		

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          25843
          		

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          24+
          		

          CDIP-18P
          		

          12
          		

          		
詢價(jià)
          

          



          TECHNICS
          		

          24+
          		

          SOP-42
          		

          3500
          		

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詢價(jià)
          

          



          Abbatron/HHSmith
          		

          新
          		

          		

          5
          		

          全新原裝 貨期兩周
          		
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          TE
          		

          25+
          		

          N/A
          		

          90000
          		

          一級(jí)代理商進(jìn)口原裝現(xiàn)貨、價(jià)格合理
          		
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          Murata
          		

          19+
          		

          		

          100000
          		

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          Belden
          		

          2022+
          		

          		

          3
          		

          全新原裝 貨期兩周
          		
詢價(jià)
          

          



          MOT
          		

          25+
          		

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          17500
          		

          普通
          		
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          更多837供應(yīng)商
            更新時(shí)間2026-1-20 14:00:00
        
          
        
          
          
          
            
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