| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:294.02 Kbytes 頁(yè)數(shù):4 Pages | EDAC 亞得電子 | EDAC | ||
837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:126.88 Kbytes 頁(yè)數(shù):2 Pages | EDAC 亞得電子 | EDAC | ||
837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:124.84 Kbytes 頁(yè)數(shù):2 Pages | EDAC 亞得電子 | EDAC | ||
837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:294.02 Kbytes 頁(yè)數(shù):4 Pages | EDAC 亞得電子 | EDAC | ||
837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:294.02 Kbytes 頁(yè)數(shù):4 Pages | EDAC 亞得電子 | EDAC | ||
837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:124.97 Kbytes 頁(yè)數(shù):2 Pages | EDAC 亞得電子 | EDAC | ||
837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:125.44 Kbytes 頁(yè)數(shù):2 Pages | EDAC 亞得電子 | EDAC | ||
837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:294.02 Kbytes 頁(yè)數(shù):4 Pages | EDAC 亞得電子 | EDAC | ||
837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:294.02 Kbytes 頁(yè)數(shù):4 Pages | EDAC 亞得電子 | EDAC | ||
837 Series,High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend 文件:125.06 Kbytes 頁(yè)數(shù):2 Pages | EDAC 亞得電子 | EDAC |
產(chǎn)品屬性
- 產(chǎn)品編號(hào):
837
- 制造商:
Adafruit Industries LLC
- 類別:
計(jì)算機(jī)設(shè)備 > 計(jì)算機(jī)鼠標(biāo),軌跡球
- 包裝:
散裝
- 接口:
PS/2
- 描述:
TRACKPAD CAP MCU-FRIENDLY PS/2
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
TI/德州儀器 |
24+ |
WSON8 |
4290 |
原廠原裝貨/代理渠道 |
詢價(jià) | ||
Master |
1931+ |
N/A |
567 |
加我qq或微信,了解更多詳細(xì)信息,體驗(yàn)一站式購(gòu)物 |
詢價(jià) | ||
WINBOND |
24+ |
QFP |
25843 |
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢(shì)庫(kù)存! |
詢價(jià) | ||
24+ |
CDIP-18P |
12 |
詢價(jià) | ||||
TECHNICS |
24+ |
SOP-42 |
3500 |
原裝現(xiàn)貨,可開(kāi)13%稅票 |
詢價(jià) | ||
Abbatron/HHSmith |
新 |
5 |
全新原裝 貨期兩周 |
詢價(jià) | |||
TE |
25+ |
N/A |
90000 |
一級(jí)代理商進(jìn)口原裝現(xiàn)貨、價(jià)格合理 |
詢價(jià) | ||
Murata |
19+ |
100000 |
原裝正品價(jià)格優(yōu)勢(shì) |
詢價(jià) | |||
Belden |
2022+ |
3 |
全新原裝 貨期兩周 |
詢價(jià) | |||
MOT |
25+ |
SOP-8 |
17500 |
普通 |
詢價(jià) |
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