| 型號 | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
絲?。?a target="_blank" title="Marking" href="/81036112a/marking.html">81036112A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/81036112a/marking.html">81036112A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/8103611ra/marking.html">8103611RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/8103611ra/marking.html">8103611RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲印：81036072A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/81036072a/marking.html">81036072A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/8103607ra/marking.html">8103607RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲印：8103607RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲印：8103607SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/8103607sa/marking.html">8103607SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices 文件：833.12 Kbytes 頁數(shù)：22 Pages | TI 德州儀器 | TI |
產(chǎn)品屬性
- 產(chǎn)品編號：
8103
- 制造商：
Keystone Electronics
- 類別：
電纜，電線 - 管理 > 電纜支撐與緊固件
- 包裝：
散裝
- 類型：
線夾，P 型
- 開口尺寸：
0.375"（9.53mm）
- 安裝類型：
緊固件
- 材料：
鍍鋅鋼
- 顏色：
銀
- 寬度：
0.500"（12.70mm）
- 面板孔尺寸：
0.203"（5.16mm）
- 材料厚度：
0.032"（0.81mm）
- 描述：
CBL CLAMP P-TYPE SILVER FASTENER
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
KeystoneElectronics |
新 |
837 |
全新原裝 貨期兩周 |
詢價(jià) | |||
Keystone Electronics |
2022+ |
833 |
全新原裝 貨期兩周 |
詢價(jià) | |||
Bourns Inc. |
25+ |
垂直式 4 PC 引腳 |
9350 |
獨(dú)立分銷商 公司只做原裝 誠心經(jīng)營 免費(fèi)試樣正品保證 |
詢價(jià) | ||
Bourns |
25+ |
電聯(lián)咨詢 |
7800 |
公司現(xiàn)貨,提供拆樣技術(shù)支持 |
詢價(jià) | ||
Bourns Inc. |
25+ |
垂直式,4 PC 引腳 |
20948 |
樣件支持,可原廠排單訂貨! |
詢價(jià) | ||
TI |
24+ |
10 |
詢價(jià) | ||||
IDT |
25+ |
QFN |
40 |
百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可 |
詢價(jià) | ||
3M |
23+ |
NA |
686 |
專做原裝正品,假一罰百! |
詢價(jià) | ||
TI |
三年內(nèi) |
1983 |
只做原裝正品 |
詢價(jià) | |||
KOREA |
19+ |
SOP28 |
20000 |
詢價(jià) |
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