2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.38um

文件：172.92 Kbytes 頁數(shù)：4 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.127um (5u)

文件：172.91 Kbytes 頁數(shù)：4 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 24 Circuits, 0.76um (30u)

文件：172.81 Kbytes 頁數(shù)：4 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127關(guān)m (5關(guān)) Gold (Au) Plating, Tin(Sn) PC TailPlating

文件：172.91 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕

2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：172.93 Kbytes 頁數(shù)：4 Pages

MOLEX

莫仕