絲印：4403；Package：DFN3333-8L；30V P-Channel Enhancement Mode MOSFET

Features ? RDS(ON), VGS@-10V,ID@-10A

文件：637.79 Kbytes 頁數(shù)：7 Pages

PANJIT

強(qiáng)茂

絲?。?strong>4403；Package：DFN3333-8L；30V P-Channel Enhancement Mode MOSFET

Features ? RDS(ON), VGS@-10V, ID@-10A

文件：599.29 Kbytes 頁數(shù)：7 Pages

PANJIT

強(qiáng)茂

絲?。?a target="_blank" title="Marking" href="/4403s/marking.html">4403S；Package：WQFN-HR；LMR60440 3V to 36V, 4A, Synchronous, Buck Converter Optimized for High Power Density, Low EMI, and Low Output Capacitance

1 Features ? Functional Safety-Capable – Documentation available to aid functional safety system design ? Wide operating input voltage: 3V to 36V (42V absolute maximum) ? Ultra-low quiescent current – Shutdown current: 0.65μA – No load standby current: 5μA ? Pin programmable output voltag

文件：1.66345 Mbytes 頁數(shù)：38 Pages

TI

德州儀器

Ethernet to 4-Port RS-232, RS-422, RS-485 Serial Server

Features ? Ethernet 10/100BaseT (autosense) ? Each port individually configurable for RS-232, RS-422, or RS-485 ? Automatic RS-485 enable/disable ? Appears as a virtual COM port to host machine ? Data rates to 230.4K bps ? Supports custom baud rates and 9-bit protocol ? Built-in watchdog/re

文件：291.27 Kbytes 頁數(shù)：2 Pages

SEALEVEL

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：643.42 Kbytes 頁數(shù)：32 Pages

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 頁數(shù)：32 Pages

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 頁數(shù)：32 Pages

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 頁數(shù)：32 Pages

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 頁數(shù)：32 Pages

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：662.27 Kbytes 頁數(shù)：32 Pages

MACOM