絲印：220；WE-TI Radial Leaded Wire Wound Inductor

General Properties: It is recommended that the temperature of the component does not exceed +125 °C under worst case conditions Ambient Temperature (referring to IR) -40 up to +85 °C Operating Temperature -40 up to +125 °C Storage Conditions (in original packaging)

文件：717.53 Kbytes 頁數(shù)：7 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍爾特伍爾特集團(tuán)

絲印：220；WE-PD Performance SMT Shielded Power Inductor

General Information: It is recommended that the temperature of the component does not exceed +150°C under worst case conditions Ambient Temperature (refering to IR) -40 up to +110 °C Operating Temperature -40 up to +150 °C Storage Conditions (in original packaging)

文件：526.74 Kbytes 頁數(shù)：6 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍爾特伍爾特集團(tuán)

絲?。?strong>220；Package：SOD-123S；2A Surface Mount Schottky Barrier Rectifiers

Features ? Low profile surface mounted application in order to optimize board space. ? Low power loss, high efficiency. ? High current capability, low forward voltage drop. ? Ultra high-speed switching. ? Silicon epitaxial planar chip, metal silicon junction. ? Suffix G indicates Halogen-fre

文件：91.46 Kbytes 頁數(shù)：3 Pages

CITC

竹懋科技

絲?。?strong>220；Package：SOD-123ST；2A Surface Mount Schottky Barrier Rectifiers

Features ? Low profile surface mounted application in order to optimize board space. ? Low power loss, high efficiency. ? High current capability, low forward voltage drop. ? Ultra high-speed switching. ? Silicon epitaxial planar chip, metal silicon junction. ? Suffix G indicates Halogen-fre

文件：104.02 Kbytes 頁數(shù)：3 Pages

CITC

竹懋科技

絲印：220；Package：SOT-23；Silicon temperature sensors

General description The temperature sensors in the KTY82 series have a positive temperature coefficient of resistance and are suitable for use in measurement and control systems. The sensors are encapsulated in the small plastic Surface Mounted Device (SMD) SOT23 package. Other special selec

文件：79.72 Kbytes 頁數(shù)：17 Pages

恩XP

絲?。?strong>220；Package：9BallCSP；Active Isolation Enhancer and Interference Canceller

Electromagnetic Interference (EMI) is emerging as a major concern in next generation wireless communication systems. As wireless terminals now support multiple services and features that utilize high data rates simultaneously, removing interference within wireless terminals like handsets has becom

文件：1.69607 Mbytes 頁數(shù)：19 Pages

RENESAS

瑞薩

絲?。?strong>220；Package：9BallCSP；Active Isolation Enhancer and Interference Canceller

Electromagnetic Interference (EMI) is emerging as a major concern in next generation wireless communication systems. As wireless terminals now support multiple services and features that utilize high data rates simultaneously, removing interference within wireless terminals like handsets has becom

文件：1.69607 Mbytes 頁數(shù)：19 Pages

RENESAS

瑞薩

絲?。?strong>220；Package：DO-214AB；Surface Mount TYS

文件：396.6 Kbytes 頁數(shù)：3 Pages

LEIDITECH

雷卯電子

絲?。?strong>220；This specification applies to SMD Shielded Power Choke

文件：635.21 Kbytes 頁數(shù)：7 Pages

LEIDITECH

雷卯電子

絲?。?strong>220；Package：WSON；DRV8220 18-V H-Bridge Motor Driver with PWM, PH/EN, and Half-Bridge Control Interfaces and Low-Power Sleep Mode

文件：4.38024 Mbytes 頁數(shù)：47 Pages

TI

德州儀器