802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ? IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ? Supports MU-MIMO (2T2R) ? Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ? Supports Linux OS ? M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：386.39 Kbytes 頁(yè)數(shù)：1 Pages

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802.11 ac/a/b/g/n Bluetooth 5.0 M.2 2230 (A-E Key) Card

Features ? IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard ? Support 802.11ac 2x2,Wave-2 compliant with MU-MIMO ? IEEE 802.11i (WPA, WPA2). Open, shared key, and pair-wise key authentication services ? Operating temperature: 0 ~ +70 °C

文件：280.51 Kbytes 頁(yè)數(shù)：1 Pages

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Development Board for SMARC v2.0 RISC Module

Features ?? Supports SGeT SMARC v2.0 CPU module board ?? 4 kinds of display outputs. 18/24-bit LVDS or MIPI DSI, HDMI, DP ?? 1 x SATA/SATA-DOM, 2 x RJ-45, 1 x USB 3.0 Type C, 1 x USB 2.0 OTG, 1 x USB 3.0, 1 x USB 2.0, 2 x USB 2.0 Pin Headers, 2 x CAN bus, 4 x UART, 12 x GPIO ?? 3 x PCIe by 1

文件：432.45 Kbytes 頁(yè)數(shù)：2 Pages

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Compact, Fanless Edge Controller with Intel? Atom? Processor, 64GB eMMC, 2 x LAN, 2 x USB, and 1 x HDMI

Features ? Intel? Atom? quad-core x6413E processor ? 4 GB/8 GB DDR4 onboard memory ? Compact, robust, fanless, cable-free design with high stability ? Optimized I/O with 2 x GbE, 2 x USB, 1 x HDMI ? Full-size mPCIe port onboard for flexible expansion ? Built-in TPM2.0 for hardware-based secu

文件：796.06 Kbytes 頁(yè)數(shù)：3 Pages

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Edge IoT Gateway with 2 x GbE, 2 x USB 3.2, 1 x mPCIe, 1 x HDMI, and 32 GB eMMC

Features ? Intel? Celeron? N6210 dual-core/Pentium? N6415 quad-core processor ? 4 GB/8 GB DDR4 onboard memory ? Compact, robust, fanless, and cable-free system with modular design ? 2 x GbE, 2 x USB 3.2 Gen 1, and 1 x HDMI 1.4 ? Optional stackable extension kits for PoE, COM, wireless connect

文件：791.72 Kbytes 頁(yè)數(shù)：4 Pages

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Intel? Atom? Pocket-Size Smart Factory Edge Gateway with 2 x GbE, 1 x mPCIe, HDMI, eMMC

Features ? Intel? Atom? E3815/E3825 processor with 4GB DDR3L onboard memory ? 2 x GbE, 1 x USB 3.0, 1 x HDMI, option 2 x RS-232/422/485 or 3 x USB2.0 ? Compact fanless design ? Rubber stopper design with internal reserved screws for 2nd layer assembly ? Diverse system I/O and isolated digital

文件：860.55 Kbytes 頁(yè)數(shù)：3 Pages

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恩XP i.MX8M Cortex?-A53 SMARC 2.0/2.1 Computer-on-Module

Features ? 恩XP i.MX 8M processor with dual or quad Arm Cortex A53 cores ? 1 x Arm Cortex-M4 core ? Onboard 2GB LPDDR4 memory and eMMC 16GB ? 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ? 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera inpu

文件：3.11774 Mbytes 頁(yè)數(shù)：4 Pages

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Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ? Intel? Atom? E3900 series ? Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ? Independent display by HDMI ? Semi-Industry Fanless slim systen, Din Rail or Wall mount design ? Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ? Flexible expansion M.2 E key, F/S miniPCIe ? 12V power

文件：1.81659 Mbytes 頁(yè)數(shù)：6 Pages

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Rockchip RK3399 Cortex-A72 ARM Based Box Computer

Features ? Rockchip RK3399 ARM Dual Cortex-A72 and Quad Cortex-A53 1.8 GHz ? Onboard 2GB LPDDR4 memory and 16GB eMMC ? Dual HDMI(4K 60fps + 1080P) ? Support 4K H.264/H.265 Video decoder ? 6 serial, 1 USB3.0, 4 USB2.0 ,1 USB OTG, 2 GbE, 1 SPI, 1 I2C, 5 GPIO ? M.2 for WIFI/BT support, mini-PCI

文件：674.81 Kbytes 頁(yè)數(shù)：2 Pages

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Industrial-Grade Nvidia Jetson Barebone Box PC

Features ? NVIDIA Jetson Module compatible Barebone PC ? Industrial and Expandable Design ? HDMI up to 3840 x 2160 at 60Hz resolution ? Dual GbE LAN, 2 USB3.2 Gen 1 ? 1 Micro SD Socket & 1 Nano SIM Slot ? 1 M.2 3042 Key B Slot, 1 M.2 2230 Key E Slot ? 4 Kinds of Rear I/O for Each Vertical F

文件：1.20611 Mbytes 頁(yè)數(shù)：3 Pages

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