802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ? IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ? Supports MU-MIMO (2T2R) ? Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ? Supports Linux OS ? M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：386.39 Kbytes 頁數(shù)：1 Pages

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Advantech USB 802.11ac/a/b/g/n 2T2R Wi-fi Bluetooth 4.2 Mini PCIe Card

Features ? IEEE 802.11 ac/a/b/g/n (2.4GHz+5GHz) standard ? USB signal with half-size Mini PCIe Card Interface ? 2T2R (Support WiFi/BT co-existence) ? Operating temperature: -20 to +70° C ? Supports Windows 7, 8.1, 10 / Linux / Android

文件：361.97 Kbytes 頁數(shù)：1 Pages

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Development Board for Qseven V2.1 ROM Modules

Features ? Supports Qseven V2.1 RISC Module ? Mini-ITX form factor ? Dual display outputs HDMI 2.0 and 24-bit LVDS ? Supports 1 x PCIe, 1 x GbE, 4 x USB 2.0, 1 x USB OTG2.0, 1 x SATAII, 1 x I2C, 1 x I2S, 1 x CANbus, 8 x GPIOs ? Support AT/ATX mode, Input power +12V ? Cable pack included ?

文件：651.51 Kbytes 頁數(shù)：2 Pages

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IEEE 802.11ax/ac/a/b/g/n Bluetooth 5.2 M.2 2230 (A-E Key) Card

Features ? IEEE 802.11ax/a/b/g/n + Bluetooth 5.2 ? Supports 2.4 GHz: 2.412 ~ 2.484 GHz , 5 GHz: 4.915 ~5.925GHz ? MU-MIMO, 2Tx/2Rx ? Operating temperature: 0~ 70°C (32~158°F)

文件：312.76 Kbytes 頁數(shù)：1 Pages

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Advantech 802.11ax BT 5.0 2T2R (HMC)

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz+5GHz) standard ? Half-Size Mini PCIe Card interface ? 2T2R (Support WiFi/BT co-existence) ? Operating temperature: -40 ~ 85 °C ? Supports Linux and Android

文件：352.17 Kbytes 頁數(shù)：1 Pages

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802.11 ac/a/b/g/n Bluetooth 5.0 M.2 2230 (A-E Key) Card

Features ? IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard ? Support 802.11ac 2x2,Wave-2 compliant with MU-MIMO ? IEEE 802.11i (WPA, WPA2). Open, shared key, and pair-wise key authentication services ? Operating temperature: 0 ~ +70 °C

文件：280.51 Kbytes 頁數(shù)：1 Pages

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Development Board for SMARC v2.0 RISC Module

Features ?? Supports SGeT SMARC v2.0 CPU module board ?? 4 kinds of display outputs. 18/24-bit LVDS or MIPI DSI, HDMI, DP ?? 1 x SATA/SATA-DOM, 2 x RJ-45, 1 x USB 3.0 Type C, 1 x USB 2.0 OTG, 1 x USB 3.0, 1 x USB 2.0, 2 x USB 2.0 Pin Headers, 2 x CAN bus, 4 x UART, 12 x GPIO ?? 3 x PCIe by 1

文件：432.45 Kbytes 頁數(shù)：2 Pages

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Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ? Intel? Atom? E3900 series ? Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ? Independent display by HDMI ? Semi-Industry Fanless slim systen, Din Rail or Wall mount design ? Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ? Flexible expansion M.2 E key, F/S miniPCIe ? 12V power

文件：1.81659 Mbytes 頁數(shù)：6 Pages

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Rockchip RK3399 Cortex-A72 ARM Based Box Computer

Features ? Rockchip RK3399 ARM Dual Cortex-A72 and Quad Cortex-A53 1.8 GHz ? Onboard 2GB LPDDR4 memory and 16GB eMMC ? Dual HDMI(4K 60fps + 1080P) ? Support 4K H.264/H.265 Video decoder ? 6 serial, 1 USB3.0, 4 USB2.0 ,1 USB OTG, 2 GbE, 1 SPI, 1 I2C, 5 GPIO ? M.2 for WIFI/BT support, mini-PCI

文件：674.81 Kbytes 頁數(shù)：2 Pages

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Industrial-Grade Nvidia Jetson Barebone Box PC

Features ? NVIDIA Jetson Module compatible Barebone PC ? Industrial and Expandable Design ? HDMI up to 3840 x 2160 at 60Hz resolution ? Dual GbE LAN, 2 USB3.2 Gen 1 ? 1 Micro SD Socket & 1 Nano SIM Slot ? 1 M.2 3042 Key B Slot, 1 M.2 2230 Key E Slot ? 4 Kinds of Rear I/O for Each Vertical F

文件：1.20611 Mbytes 頁數(shù)：3 Pages

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