ESD CUT RESISTANT GLOVES

Product Description Fabric: Ultra-high-molecular-weight polyethylene Confifuration: Elastic Wrist Liner Color: Grey Coating Color: White Shelf Life: Functional: 1 year

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DESCO

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

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EXTREMENETWORKS

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

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EXTREMENETWORKS

包裝：袋 類別：靜電控制，防靜電，ESD，無塵室產(chǎn)品 靜電控制，防靜電服 描述：GLOVE, CUT-RESISTANT, XSMALL

DESCO

PCB terminal block - SMKDS 3/12

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PHOENIXPHOENIX CONTACT

菲尼克斯德國菲尼克斯電氣集團(tuán)

PCB terminal block - SMKDS 3/ 6

文件：71.97 Kbytes 頁數(shù)：6 Pages

PHOENIXPHOENIX CONTACT

菲尼克斯德國菲尼克斯電氣集團(tuán)

Impel 92 Ohm, 4 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided

文件：66.29 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕

Impel 92 Ohm, 4 Pair Right-Angle Daughtercard, 1.90mm Pitch, Unguided

文件：62.57 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕

Impel 92 Ohm, 4 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided

文件：66.28 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕

Impel 92 Ohm, 4 Pair Vertical Backplane Header, 1.90mm Pitch,

文件：66.29 Kbytes 頁數(shù)：2 Pages

MOLEX

莫仕