Customer Specification

Construction Diameters (In) 1) Component 1 1 X 1 COND a) Conductor 24 (10/34) AWG Tinned Copper 0.024 b) Insulation 0.020 Wall, Nom. Polyethylene(PE) 0.064 (1) Color(s) Cond Color Cond Color Cond Color 1 WHITE 2) Shield Tinned Copper BRAID Shield,90 Coverage, Min. 3) Jacket 0.030 Wall,

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ALPHAWIRE

Shorty Plugs

文件：112.72 Kbytes 頁數(shù)：1 Pages

HEYCO

Thermometrics temperature sensor solutions

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AMPHENOL

安費(fèi)諾

The MagPi - Issue 13

Welcome to issue 13 of The MagPi - the premier Raspberry Pi magazine for beginners, experts, Pi-fanatics and the merely Pi-curious.\n\nWelcome to the 13th issue of The MagPi! This month, the MagPi is proud and thankful to be able to showcase the super smart Amy Mather as she talks about Conway’s Gam

Adafruit Industries

Modular FPM - Video Input Box Module with 2 I/O Slots

Features ? Monitor Box with 2 flexible I/O slots to accommodate FPM-M700 I/O modules for video signal or long distance transmission ? Multiple sized front panel module offering with P-Cap multi-touch sensor (12.1 & 19 w/ robust 5-wire resistive touch) ? Supports USB touch and two independent

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ADVANTECH

研華科技

15 XGA TFT LED LCD Thin-Client Terminal with Intel? Atom? Processor and UL Class 1 Division 2

Features ? Industrial-grade 15 XGA TFT LCD with 70K lifetime and LED backlight ? Intel? Atom? E3845 1.91 GHz quad-core processor with 4 GB DDR3L SDRAM and 64G SSD ? In-cabinet Design with True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel ? UL C1D2 certified

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ADVANTECH

研華科技

18.5 WXGA TFT LED LCD Touch Panel Computer with 8th Gen. Intel? Core? i5 Processor, built-in 8G DDR4 RAM and UL Class 1 Division 2

Features ? Industrial-grade 18.5 WXGA TFT LCD with 50K lifetime and LED backlight ? 8th Gen. Intel? Core? i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMM ? Dual channel memory slots support up to 64G in total ? Compact, fanless embedded system with aluminum alloy front bezel and

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ADVANTECH

研華科技

Modular TPC - Computing Box Module with Intel? 6th Gen. Core? i CPU

Features ? Computing Box powered by Intel? Core? i3-6100U/i5-6300U/ i7-6600U with 8GB SODIMM ? Supports two independent video interfaces with picture-in-picture function and up to 100m long signal transmission distance (iLINK technology) (iLINK technology) ? Multiple sized front panel module

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ADVANTECH

研華科技

Modular TPC - Computing Box Module with Intel? 10th Gen. Core? i CPU Socket (LGA1200)

Features ? High Performance Computing Box powered by Intel? 10th Gen. Core? i CPU Socket (LGA1200) with fanless design ? 6 x Panel Modules (IP66) ranging from 15 to 23.8 in selection ? Dual Channel Memory slots (DDR4) support up to 64GB in total ? Comprehensive I/Os, including 6 x USB, 2 x CO

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ADVANTECH

研華科技

LGA1200 10th Gen Intel? Core? i9/i7/i5/ i3 Half-size SHB with PCIe 3.0/ Dual Independent Display/Dual GbE LAN/ SATA III/USB 3.2

Features ? Complies with PICMG 1.3 ? Supports Intel? Core? i9/i7/i5/i3/Celeron?/Pentium? processor with H420E chipset ? Dual Channel (Non-ECC) DDR4 2666/2933 up to 64 GB ? Supports USB 3.2, SATA III, PCIe 3.0 ? Supports CRT and DVI-D/DP (optional) display ? Supports Advantech TPM module (op

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ADVANTECH

研華科技